Select how often (in days) to receive an alert: Experience Level: Professional Job Type: Regular Location: Richardson, TX, US, 75081 Requisition ID: 9735 Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems‑level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high‑growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery‑powered appliances, network infrastructure, healthcare and aerospace/defense. Visit to learn how our innovative team is helping connect, protect and power our planet. Qorvo is looking for Semiconductor Packaging Engineers in RF Packaging who can join Qorvo’s Packaging team in Richardson, Texas. Ideal candidate will learn and utilize semiconductor packaging experience to develop and drive new packaging technologies for next generation product requirements from concept to high volume manufacturing. Strong communication and presentation skills. Ability to excel in a dynamic collaborative team environment including working directly with the product line design teams. Responsibilities: Provide best in class industry “know‑how” to enable continued global leadership of Qorvo packaging solutions. Utilize program management methodology to plan, execute and monitor complex process and/or product development projects. Facilitate or lead cross‑functional technical teams through New Product Introduction (NPI) and/or problem solving. Design for manufacturability and cost to ensure smooth transition to High Volume Manufacturing. Develop and deploy advanced design rules into next generation products. Work in collaboration with technology and business units to deploy next generation packaging solutions incorporating GaN, Si and GaAs semiconductor devices into products. Qualifications: BS degree or higher in Engineering or Material Science Industry knowledge and experience of semiconductor packaging technologies. Background in process/packaging technologies preferably with direct experience in either RF Modules or high power and high frequency packages. Knowledgeable across a wide range of assembly, packaging, processes technologies and materials e.g., fan‑out, wafer level packaging, SMT, Die Attach, Wire Bond / Flip Chip, Molding, interconnect, laminate, etc. Understanding of Design for Manufacturability and requirements needed to ramp these technologies in a high volume manufacturing environment. Ability to utilize SPC techniques, DOE, and structured problem solving methodologies (e.g. DMAIC, 8D). Experience with Program Management Methodology. This position is not eligible for visa sponsorship by the Company.
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